Thermal Gap Pads
TIF700 Silicone Gap Pad 7.0 W/mK
TIF700
High-compression soft pad for uneven interfaces, 0.5–5 mm.
Technische Daten
| Parameter | Typischer Wert |
|---|---|
| 1 | |
| 2 | 3 |
| 4 | |
| 5 | 6 |
Überblick
TIF700 delivers stable interface contact at 10–30 psi assembly pressure, well suited to power modules with generous tolerances.